Harrier Enterprises

·             Polypropylene Working Chamber (removable), size 6-inch dia, with transparent photo resist lid with interlock safety switch.

·             500 – 9999 RPM 

·             Accuracy<±0.5% of Full Speed

·             Microprocessor Programmable Speed control with respect to time Preset editable programs of 1 program X 64 step 

·             Real time display of RPM, time and program stamps

·             Nonvolatile program memory

·             Input & control through soft touch key pad.

·             Vacuum release switch

·             Substrate size from 0. 04sq.inch (28 sq.mm) to 4.0 sq. inch   

        (for glass substrate) & 20.0 sq. inch (for silicon wafers)

·             Vacuum chuck: derlin made circular substrate holders of Dia 0.5”,1”,1.5”,2.0” inch 

·             Microprocessor control A C brush less motor

·             Acceleration 2000 rpm/sec (Maximum) use settable

·             Calibration option. 

·             Vacuum Dial gauge.

·             Frame: Epoxy coated MS.

·             Facility for interlocking with Vacuum Pump.

·       Tubing for Vacuum.

·       Gas Purging Attachment for Nitrogen. 

·       Spill drainage facility 

·       To operate on 230V ± 10%, 1 phase 50 Hz AC only.

·       Maximum Power 190W, Current 1.0 Amp.

·             Polypropylene Working Chamber (removable), size 6-inch dia, with transparent photo resist lid with interlock safety switch.

·             500 – 8000 RPM 

·             Accuracy<±0.5% of Full Speed

·             Microprocessor Programmable Speed control with respect to time Preset editable programs of 1 program X 64 step 

·             Real time display of RPM, time and program stamps

·             Nonvolatile program memory

·             Input & control through soft touch key pad.

·             Vacuum release switch

·             Substrate size from 0. 04sq.inch (28 sq.mm) to 4.0 sq. inch   

        (for glass substrate) & 20.0 sq. inch (for silicon wafers)

·             Vacuum chuck: derlin made circular substrate holders of Dia 0.5”,1”,1.5”,2.0” inch 

·             Microprocessor control A C brush less motor

·             Acceleration 2000 rpm/sec (Maximum) use settable

·             Calibration option. 

·             Vacuum Dial gauge.

·             Frame: Epoxy coated MS.

·             Facility for interlocking with Vacuum Pump.

·       Tubing for Vacuum.

·       Gas Purging Attachment for Nitrogen. 

·       Spill drainage facility 

·       To operate on 230V ± 10%, 1 phase 50 Hz AC only.

·       Maximum Power 190W, Current 1.0 Amp.

·             Polypropylene Working Chamber (removable), size 6-inch dia, with transparent photo resist lid with interlock safety switch.

·             500 – 9999 RPM 

·             Accuracy<±0.5% of Full Speed

·             Microprocessor Programmable Speed control with respect to time Preset editable programs of 1 program X 64 step 

·             Real time display of RPM, time and program stamps

·             Nonvolatile program memory

·             Input & control through soft touch key pad.

·             Vacuum release switch

·             Substrate size from 0. 04sq.inch (28 sq.mm) to 4.0 sq. inch   

        (for glass substrate) & 20.0 sq. inch (for silicon wafers)

·             Vacuum chuck: derlin made circular substrate holders of Dia 0.5”,1”,1.5”,2.0” inch 

·             Microprocessor control A C brush less motor

·             Acceleration 2000 rpm/sec (Maximum) use settable

·             Calibration option. 

·             Vacuum Dial gauge.

·             Frame: Epoxy coated MS.

·             Facility for interlocking with Vacuum Pump.

·       Tubing for Vacuum.

·       Gas Purging Attachment for Nitrogen. 

·       Spill drainage facility 

·       To operate on 230V ± 10%, 1 phase 50 Hz AC only.

·       Maximum Power 190W, Current 1.0 Amp.

·             Polypropylene Working Chamber (removable), size 6-inch dia, with transparent photo resist lid with interlock safety switch.

·             500 – 9999 RPM 

·             Accuracy<±0.5% of Full Speed

·             Microprocessor Programmable Speed control with respect to time Preset editable programs of 1 program X 64 step 

·             Real time display of RPM, time and program stamps

·             Nonvolatile program memory

·             Input & control through soft touch key pad.

·             Vacuum release switch

·             Substrate size from 0. 04sq.inch (28 sq.mm) to 4.0 sq. inch   

        (for glass substrate) & 20.0 sq. inch (for silicon wafers)

·             Vacuum chuck: derlin made circular substrate holders of Dia 0.5”,1”,1.5”,2.0” inch 

·             Microprocessor control A C brush less motor

·             Acceleration 2000 rpm/sec (Maximum) use settable

·             Calibration option. 

·             Vacuum Dial gauge.

·             Frame: Epoxy coated MS.

·             Facility for interlocking with Vacuum Pump.

·       Tubing for Vacuum.

·       Gas Purging Attachment for Nitrogen. 

·       Spill drainage facility 

·       To operate on 230V ± 10%, 1 phase 50 Hz AC only.

·       Maximum Power 190W, Current 1.0 Amp.